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Datasheet Texas Instruments SN54LVC00A — Даташит

ПроизводительTexas Instruments
СерияSN54LVC00A
Datasheet Texas Instruments SN54LVC00A

Quadruple 2-Input Positive-NAND Gate

Datasheets

SNx4LVC00A Quadruple 2-Input Positive-NAND Gates datasheet
PDF, 1.4 Мб, Версия: R, Файл опубликован: 3 фев 2016
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Цены

T-electron
Россия и страны СНГ
SN54LVC00A-SP
Texas Instruments
по запросу
SN54LVC00A_07
Texas Instruments
по запросу
LifeElectronics
Россия
SN54LVC00A
Texas Instruments
по запросу
SN54LVC00A_10
Texas Instruments
по запросу
Сравнительное тестирование аккумуляторов EVE Energy и Samsung типоразмера 18650

Статус

5962-9753301Q2A5962-9753301QCA5962-9753301QDASNJ54LVC00AFKSNJ54LVC00AJSNJ54LVC00AW
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНетНетНет

Корпус / Упаковка / Маркировка

5962-9753301Q2A5962-9753301QCA5962-9753301QDASNJ54LVC00AFKSNJ54LVC00AJSNJ54LVC00AW
N123456
Pin201414201414
Package TypeFKJWFKJW
Industry STD TermLCCCCDIPCFPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY111111
CarrierTUBETUBETUBETUBETUBETUBE
Маркировка00AFKSNJ54LVC00AJA5962-A5962-9753301QD
Width (мм)8.896.675.978.896.675.97
Length (мм)8.8919.569.218.8919.569.21
Thickness (мм)1.834.571.591.834.571.59
Pitch (мм)1.272.541.271.272.541.27
Max Height (мм)2.035.082.032.035.082.03
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models5962-9753301Q2A
5962-9753301Q2A
5962-9753301QCA
5962-9753301QCA
5962-9753301QDA
5962-9753301QDA
SNJ54LVC00AFK
SNJ54LVC00AFK
SNJ54LVC00AJ
SNJ54LVC00AJ
SNJ54LVC00AW
SNJ54LVC00AW
F @ Nom Voltage(Max), Mhz150150150150150150
ICC @ Nom Voltage(Max), мА0.010.010.010.010.010.01
Тип входаTTLTTLTTLTTLTTLTTL
Рабочий диапазон температур, Cот -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125от -55 до 125
Output Drive (IOL/IOH)(Max), мА24/-2424/-2424/-2424/-2424/-2424/-24
Тип выходаTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCFPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyLVCLVCLVCLVCLVCLVC
VCC(Max), В3.63.63.63.63.63.6
VCC(Min), В222222
tpd @ Nom Voltage(Max), нс5.1,4.35.1,4.35.1,4.35.1,4.35.1,4.35.1,4.3

Экологический статус

5962-9753301Q2A5962-9753301QCA5962-9753301QDASNJ54LVC00AFKSNJ54LVC00AJSNJ54LVC00AW
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

  • LVC Characterization Information
    PDF, 114 Кб, Файл опубликован: 1 дек 1996
    This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Мб, Версия: A, Файл опубликован: 26 июл 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Кб, Файл опубликован: 1 май 1996
  • Selecting the Right Texas Instruments Signal Switch
    PDF, 769 Кб, Файл опубликован: 7 сен 2001
    Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Кб, Файл опубликован: 1 дек 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Кб, Файл опубликован: 10 май 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • Use of the CMOS Unbuffered Inverter in Oscillator Circuits
    PDF, 796 Кб, Файл опубликован: 6 ноя 2003
    CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Texas Instruments Little Logic Application Report
    PDF, 359 Кб, Файл опубликован: 1 ноя 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

Модельный ряд

Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products

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