Datasheet Texas Instruments SN54S30 — Даташит
| Производитель | Texas Instruments |
| Серия | SN54S30 |
8-входовые логические элементы положительного NAND
Datasheets
8-Input Positive-NAND Gates datasheet
PDF, 1.1 Мб, Файл опубликован: 1 мар 1988
Выписка из документа
Цены
 Купить SN54S30 на РадиоЛоцман.Цены — от 490 до 4 606 ₽15 предложений от 13 поставщиков Микросхема Логический чип, NAND Gate 1Element 8IN Bipolar 14Pin CDIP Tube | |||
| SN54S30J Texas Instruments | 490 ₽ | ||
| SN54S30J Texas Instruments | 970 ₽ | ||
| SN54S30J | по запросу | ||
| SN54S30J Texas Instruments | по запросу | ||
Статус
| 5962-9679201QCA | 5962-9679201QDA | SN54S30J | SNJ54S30J | SNJ54S30W | |
|---|---|---|---|---|---|
| Статус продукта | В производстве | В производстве | В производстве | В производстве | В производстве |
| Доступность образцов у производителя | Нет | Нет | Нет | Нет | Нет |
Корпус / Упаковка / Маркировка
| 5962-9679201QCA | 5962-9679201QDA | SN54S30J | SNJ54S30J | SNJ54S30W | |
|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 |
| Pin | 14 | 14 | 14 | 14 | 14 |
| Package Type | J | W | J | J | W |
| Industry STD Term | CDIP | CFP | CDIP | CDIP | CFP |
| JEDEC Code | R-GDIP-T | R-GDFP-F | R-GDIP-T | R-GDIP-T | R-GDFP-F |
| Package QTY | 1 | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE | TUBE |
| Маркировка | 5962-9679201QC | SNJ54S30W | SN54S30J | 5962-9679201QC | SNJ54S30W |
| Width (мм) | 6.67 | 5.97 | 6.67 | 6.67 | 5.97 |
| Length (мм) | 19.56 | 9.21 | 19.56 | 19.56 | 9.21 |
| Thickness (мм) | 4.57 | 1.59 | 4.57 | 4.57 | 1.59 |
| Pitch (мм) | 2.54 | 1.27 | 2.54 | 2.54 | 1.27 |
| Max Height (мм) | 5.08 | 2.03 | 5.08 | 5.08 | 2.03 |
| Mechanical Data | Скачать | Скачать | Скачать | Скачать | Скачать |
Параметры
| Parameters / Models | 5962-9679201QCA | 5962-9679201QDA | SN54S30J | SNJ54S30J | SNJ54S30W |
|---|---|---|---|---|---|
| Тип входа | TTL | TTL | TTL | TTL | TTL |
| Рабочий диапазон температур, C | от -55 до 125 | от -55 до 125 | от -55 до 125 | от -55 до 125 | от -55 до 125 |
| Тип выхода | TTL | TTL | TTL | TTL | TTL |
| Package Group | CDIP | CFP | CDIP | CDIP | CFP |
| Package Size: mm2:W x L, PKG | See datasheet (CDIP) | See datasheet (CFP) | See datasheet (CDIP) | See datasheet (CDIP) | See datasheet (CFP) |
| Rating | Military | Military | Military | Military | Military |
| Schmitt Trigger | No | No | No | No | No |
| Technology Family | S | S | S | S | S |
| VCC(Max), В | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
| VCC(Min), В | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
Экологический статус
| 5962-9679201QCA | 5962-9679201QDA | SN54S30J | SNJ54S30J | SNJ54S30W | |
|---|---|---|---|---|---|
| RoHS | See ti.com | See ti.com | See ti.com | See ti.com | See ti.com |
Application Notes
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Мб, Файл опубликован: 1 окт 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Live InsertionPDF, 150 Кб, Файл опубликован: 1 окт 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Кб, Файл опубликован: 8 июл 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Кб, Файл опубликован: 30 апр 2015
Модельный ряд
Серия: SN54S30 (5)
Классификация производителя
- Semiconductors> Space & High Reliability> Logic Products> Gate Products
