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Datasheet Texas Instruments SN74ABT162244 — Даташит

ПроизводительTexas Instruments
СерияSN74ABT162244
Datasheet Texas Instruments SN74ABT162244

16-Bit Buffers/Drivers With 3-State Outputs

Datasheets

SN54ABT162244, SN74ABT162244 datasheet
PDF, 774 Кб, Версия: E, Файл опубликован: 3 июн 2004
Выписка из документа

Цены

31 предложений от 24 поставщиков
IC: цифровая; буфер,неинвертирующая,драйвер линии; Ch: 16; SMD
SN74ABT162244DL
Texas Instruments
29 ₽
Akcel
Весь мир
SN74ABT162244DGVR
Texas Instruments
от 32 ₽
ЗУМ-СМД
Россия
SN74ABT162244DGGR
Texas Instruments
по запросу
SN74ABT162244NS
Texas Instruments
по запросу
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

74ABT162244DGGRG4SN74ABT162244DGGRSN74ABT162244DGVRSN74ABT162244DLSN74ABT162244DLG4SN74ABT162244DLR
Статус продуктаВ производствеВ производствеВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНетНетНетНет

Корпус / Упаковка / Маркировка

74ABT162244DGGRG4SN74ABT162244DGGRSN74ABT162244DGVRSN74ABT162244DLSN74ABT162244DLG4SN74ABT162244DLR
N123456
Pin484848484848
Package TypeDGGDGGDGVDLDLDL
Industry STD TermTSSOPTSSOPTVSOPSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY20002000200025251000
CarrierLARGE T&RLARGE T&RLARGE T&RTUBETUBELARGE T&R
МаркировкаABT162244ABT162244AH2244ABT162244ABT162244ABT162244
Width (мм)6.16.14.47.497.497.49
Length (мм)12.512.59.715.8815.8815.88
Thickness (мм)1.151.151.052.592.592.59
Pitch (мм).5.5.4.635.635.635
Max Height (мм)1.21.21.22.792.792.79
Mechanical DataСкачатьСкачатьСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models74ABT162244DGGRG4
74ABT162244DGGRG4
SN74ABT162244DGGR
SN74ABT162244DGGR
SN74ABT162244DGVR
SN74ABT162244DGVR
SN74ABT162244DL
SN74ABT162244DL
SN74ABT162244DLG4
SN74ABT162244DLG4
SN74ABT162244DLR
SN74ABT162244DLR
Bits161616161616
F @ Nom Voltage(Max), Mhz150150150150150150
ICC @ Nom Voltage(Max), мА0.030.030.030.030.030.03
Рабочий диапазон температур, Cот -40 до 85от -40 до 85от -40 до 85от -40 до 85от -40 до 85от -40 до 85
Output Drive (IOL/IOH)(Max), мА-12/12-12/12-12/12-12/12-12/12-12/12
Package GroupTSSOPTSSOPTVSOPSSOPSSOPSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyABTABTABTABTABTABT
VCC(Max), В5.55.55.55.55.55.5
VCC(Min), В4.54.54.54.54.54.5
Voltage(Nom), В555555
tpd @ Nom Voltage(Max), нс4.84.84.84.84.84.8

Экологический статус

74ABT162244DGGRG4SN74ABT162244DGGRSN74ABT162244DGVRSN74ABT162244DLSN74ABT162244DLG4SN74ABT162244DLR
RoHSСовместимСовместимСовместимСовместимСовместимСовместим

Application Notes

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    PDF, 1.0 Мб, Версия: D, Файл опубликован: 16 фев 2004
    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Кб, Версия: B, Файл опубликован: 1 июн 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Кб, Версия: A, Файл опубликован: 1 мар 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Кб, Версия: A, Файл опубликован: 1 дек 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Кб, Файл опубликован: 1 май 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Кб, Файл опубликован: 10 май 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Мб, Файл опубликован: 1 окт 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Кб, Версия: C, Файл опубликован: 1 июн 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w

Модельный ряд

Классификация производителя

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver

На английском языке: Datasheet Texas Instruments SN74ABT162244

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