Datasheet Texas Instruments SN74ABT373 — Даташит

Производитель	Texas Instruments
Серия	SN74ABT373

Datasheets

Цены

Купить SN74ABT373 на РадиоЛоцман.Цены — от 7.28 до 68 ₽ 42 предложений от 28 поставщиков IC: цифровая; защелка D-типа; Ch: 8; BiCMOS,TTL; 4,5÷5,5ВDC; SMD
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Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	SN74ABT373DBR	SN74ABT373DBRG4	SN74ABT373DW	SN74ABT373DWG4	SN74ABT373DWR	SN74ABT373N	SN74ABT373NSR	SN74ABT373NSRE4	SN74ABT373NSRG4	SN74ABT373PW	SN74ABT373PWE4	SN74ABT373PWR
3-State Output	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Bits	8	8	8	8	8	8	8	8	8	8	8	8
F @ Nom Voltage(Max), Mhz	150	150	150	150	150	150	150	150	150	150	150	150
ICC @ Nom Voltage(Max), мА	30	30	30	30	30	30	30	30	30	30	30	30
Рабочий диапазон температур, C	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85	от -40 до 85
Output Drive (IOL/IOH)(Max), мА	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32
Package Group	SSOP	SSOP	SOIC	SOIC	SOIC	PDIP	SO	SO	SO	TSSOP	TSSOP	TSSOP
Package Size: mm2:W x L, PKG	20SSOP: 56 mm2: 7.8 x 7.2(SSOP)	20SSOP: 56 mm2: 7.8 x 7.2(SSOP)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	See datasheet (PDIP)	20SO: 98 mm2: 7.8 x 12.6(SO)	20SO: 98 mm2: 7.8 x 12.6(SO)	20SO: 98 mm2: 7.8 x 12.6(SO)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No	No	No	No	No	No	No	No	No	No
Technology Family	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT
VCC(Max), В	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), В	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5
Voltage(Nom), В	5	5	5	5	5	5	5	5	5	5	5	5
tpd @ Nom Voltage(Max), нс	7.2	7.2	7.2	7.2	7.2	7.2	7.2	7.2	7.2	7.2	7.2	7.2

Экологический статус

Application Notes

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  Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
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  Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
  PDF, 528 Кб, Версия: B, Файл опубликован: 1 июн 1997
  The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
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  Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
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  Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
  PDF, 80 Кб, Версия: A, Файл опубликован: 1 дек 1996
  This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
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  Understanding Advanced Bus-Interface Products Design Guide
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  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Кб, Файл опубликован: 10 май 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Модельный ряд

Классификация производителя

• Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Latch