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Datasheet Texas Instruments SN74AHC1G04-Q1 — Даташит

ПроизводительTexas Instruments
СерияSN74AHC1G04-Q1
Datasheet Texas Instruments SN74AHC1G04-Q1

Automotive Catalog Single Inverter Gate

Datasheets

Single Inverter Gate datasheet
PDF, 977 Кб, Версия: A, Файл опубликован: 15 апр 2008
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Цены

SN74AHC1G04-Q1
Texas Instruments
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Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

1A1G04QDBVRG4Q1CAHC1G04QDCKRG4Q1SN74AHC1G04QDBVRQ1SN74AHC1G04QDCKRQ1
Статус продуктаВ производствеВ производствеВ производствеВ производстве
Доступность образцов у производителяДаДаНетНет

Корпус / Упаковка / Маркировка

1A1G04QDBVRG4Q1CAHC1G04QDCKRG4Q1SN74AHC1G04QDBVRQ1SN74AHC1G04QDCKRQ1
N1234
Pin5555
Package TypeDBVDCKDBVDCK
Industry STD TermSOT-23SOT-SC70SOT-23SOT-SC70
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY3000300030003000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&R
МаркировкаA04SACUA04SACS
Width (мм)1.61.251.61.25
Length (мм)2.922.92
Thickness (мм)1.2.91.2.9
Pitch (мм)0.95.65.95.65
Max Height (мм)1.451.11.451.1
Mechanical DataСкачатьСкачатьСкачатьСкачать

Параметры

Parameters / Models1A1G04QDBVRG4Q1
1A1G04QDBVRG4Q1
CAHC1G04QDCKRG4Q1
CAHC1G04QDCKRG4Q1
SN74AHC1G04QDBVRQ1
SN74AHC1G04QDBVRQ1
SN74AHC1G04QDCKRQ1
SN74AHC1G04QDCKRQ1
3-State OutputNoNoNo
Approx. price, US$.065 | 1ku
Bits111
F @ Nom Voltage(Max), Mhz757575
Основные особенностиBalanced outputs,Very high speed (tpd 5-10ns),Over-voltage tolerant inputs
Gate TypeINVERTER BUFFERINVERTER BUFFERINVERTER BUFFER
ICC @ Nom Voltage(Max), мА0.010.010.01
ICC(Max), uA10
IOH(Max), мА-8
IOL(Max), мА8
Input typeStandard CMOS
LogicInvertingInvertingInverting
Number of channels1
Рабочий диапазон температур, Cот -40 до 125от -40 до 125от -40 до 125
Operating temperature range, C-40 to 125
Output Drive (IOL/IOH)(Max), мА8/-88/-88/-8
Output typePush-Pull
Package GroupSC70|5,SOT-23|5SC70SOT-23SC70
Package Size: mm2:W x L, PKG5SC70: 4 mm2: 2.1 x 2(SC70)5SOT-23: 8 mm2: 2.8 x 2.9(SOT-23)5SC70: 4 mm2: 2.1 x 2(SC70)
RatingAutomotiveAutomotiveAutomotiveAutomotive
Schmitt TriggerNoNoNo
Special FeaturesDown translation to Vcc,low powerDown translation to Vcc,low powerDown translation to Vcc,low power
Sub-FamilyInverting Buffer/DriverInverting Buffer/DriverInverting Buffer/Driver
Supply voltage(Max), В5.5
Supply voltage(Min), В2
Technology FamilyAHCAHCAHCAHC
VCC(Max), В5.55.55.5
VCC(Min), В222
Voltage(Nom), В3.3,53.3,53.3,5
tpd @ Nom Voltage(Max), нс10.6,7.510.6,7.510.6,7.5

Экологический статус

1A1G04QDBVRG4Q1CAHC1G04QDCKRG4Q1SN74AHC1G04QDBVRQ1SN74AHC1G04QDCKRQ1
RoHSСовместимСовместимСовместимСовместим
Бессвинцовая технология (Pb Free)Да

Application Notes

  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Мб, Версия: A, Файл опубликован: 26 июл 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Кб, Файл опубликован: 1 дек 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Кб, Файл опубликован: 1 ноя 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Кб, Версия: A, Файл опубликован: 8 сен 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)
    PDF, 102 Кб, Версия: C, Файл опубликован: 2 дек 2002
    The Texas Instruments (TI) advanced high-speed CMOS (AHC) logic family provides a natural migration for high-speed CMOS (HCMOS) users who need more speed for low-power and low-drive applications. Unlike many other advanced logic families AHC does not have the drawbacks that come with higher speed e.g. higher signal noise and power consumption. The AHC logic family consists of gates medium-sca
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Кб, Версия: A, Файл опубликован: 22 июн 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Live Insertion
    PDF, 150 Кб, Файл опубликован: 1 окт 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Introduction to Logic
    PDF, 93 Кб, Файл опубликован: 30 апр 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Кб, Версия: D, Файл опубликован: 23 июн 2016
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Кб, Версия: C, Файл опубликован: 2 дек 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Кб, Файл опубликован: 8 июл 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Кб, Файл опубликован: 29 авг 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Кб, Версия: B, Файл опубликован: 1 июн 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

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Классификация производителя

  • Semiconductors> Logic> Little Logic

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