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Datasheet Texas Instruments SN74ALVC162268 — Даташит

ПроизводительTexas Instruments
СерияSN74ALVC162268

12-битный на 24-битный зарегистрированный обменник шины с выходами с 3 состояниями

Datasheets

12-Bit To 24-Bit Registered Bus Exchanger With 3-State Outputs
PDF, 193 Кб, Файл опубликован: 1 авг 1995

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, 12Bit To 24Bit egistered Bus Exchanger With 3-State Outputs 56-SSOP -40℃ to 85℃
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Статус

SN74ALVC162268DLSN74ALVC162268DLR
Статус продуктаСнят с производстваСнят с производства
Доступность образцов у производителяНетНет

Корпус / Упаковка / Маркировка

SN74ALVC162268DLSN74ALVC162268DLR
N12
Pin5656
Package TypeDLDL
Industry STD TermSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-G
Width (мм)7.497.49
Length (мм)18.4118.41
Thickness (мм)2.592.59
Pitch (мм).635.635
Max Height (мм)2.792.79
Mechanical DataСкачатьСкачать

Экологический статус

SN74ALVC162268DLSN74ALVC162268DLR
RoHSНе совместимНе совместим
Бессвинцовая технология (Pb Free)НетНет

Application Notes

  • TI SN74ALVC16835 Component Specification Analysis for PC100
    PDF, 43 Кб, Файл опубликован: 3 авг 1998
    The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
  • Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
    PDF, 96 Кб, Версия: A, Файл опубликован: 13 май 1998
    Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Кб, Файл опубликован: 1 май 1996
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Кб, Версия: A, Файл опубликован: 8 сен 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families

Модельный ряд

Серия: SN74ALVC162268 (2)

Классификация производителя

  • Semiconductors> Logic> Universal Bus Function> Universal Bus Exchanger (UBE)

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