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Datasheet Texas Instruments SN74LVC540A-Q1 — Даташит

ПроизводительTexas Instruments
СерияSN74LVC540A-Q1
Datasheet Texas Instruments SN74LVC540A-Q1

Automotive Catalog Octal Buffer/Driver With 3-State Outputs

Datasheets

Octal Buffer/Driver With 3-State Outputs datasheet
PDF, 1.0 Мб, Версия: B, Файл опубликован: 12 фев 2008
Выписка из документа

Цены

SN74LVC540A-Q1
Texas Instruments
по запросу
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов

Статус

CLVC540AQDWRG4Q1CLVC540AQPWRG4Q1SN74LVC540AQPWRQ1
Статус продуктаВ производствеВ производствеВ производстве
Доступность образцов у производителяНетНетНет

Корпус / Упаковка / Маркировка

CLVC540AQDWRG4Q1CLVC540AQPWRG4Q1SN74LVC540AQPWRQ1
N123
Pin202020
Package TypeDWPWPW
Industry STD TermSOICTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200020002000
CarrierLARGE T&RLARGE T&RLARGE T&R
МаркировкаL540AQ1L540AQ1L540AQ1
Width (мм)7.54.44.4
Length (мм)12.86.56.5
Thickness (мм)2.3511
Pitch (мм)1.27.65.65
Max Height (мм)2.651.21.2
Mechanical DataСкачатьСкачатьСкачать

Параметры

Parameters / ModelsCLVC540AQDWRG4Q1
CLVC540AQDWRG4Q1
CLVC540AQPWRG4Q1
CLVC540AQPWRG4Q1
SN74LVC540AQPWRQ1
SN74LVC540AQPWRQ1
Bits888
F @ Nom Voltage(Max), Mhz100100100
ICC @ Nom Voltage(Max), мА0.010.010.01
Рабочий диапазон температур, Cот -40 до 125от -40 до 125от -40 до 125
Output Drive (IOL/IOH)(Max), мА-24/24-24/24-24/24
Package GroupSOICTSSOPTSSOP
Package Size: mm2:W x L, PKG20SOIC: 132 mm2: 10.3 x 12.8(SOIC)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
RatingAutomotiveAutomotiveAutomotive
Schmitt TriggerNoNoNo
Technology FamilyLVCLVCLVC
VCC(Max), В3.63.63.6
VCC(Min), В222
Voltage(Nom), В2.7,3.32.7,3.32.7,3.3
tpd @ Nom Voltage(Max), нс7.1,5.37.1,5.37.1,5.3

Экологический статус

CLVC540AQDWRG4Q1CLVC540AQPWRG4Q1SN74LVC540AQPWRQ1
RoHSСовместимСовместимСовместим

Application Notes

  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • LVC Characterization Information
    PDF, 114 Кб, Файл опубликован: 1 дек 1996
    This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
  • Use of the CMOS Unbuffered Inverter in Oscillator Circuits
    PDF, 796 Кб, Файл опубликован: 6 ноя 2003
    CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Кб, Файл опубликован: 1 май 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Кб, Файл опубликован: 10 май 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Мб, Версия: A, Файл опубликован: 26 июл 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Кб, Файл опубликован: 1 дек 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Кб, Файл опубликован: 1 ноя 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond

Модельный ряд

Классификация производителя

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Inverting Buffer/Driver

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