Datasheet Texas Instruments SN74LVTH16373-EP — Даташит

Производитель	Texas Instruments
Серия	SN74LVTH16373-EP

Datasheets

Цены

Купить SN74LVTH16373 на РадиоЛоцман.Цены — от 24 до 258 ₽ 51 предложений от 28 поставщиков Микросхема Логический замок, Latch Transparent 3-ST 16CH D-Type 48Pin TSSOP T/R Latch Transparent 3-ST 16CH D-Type 48Pin TSSOP T/R
EIS Components Весь мир	SN74LVTH16373DGGR Texas Instruments	49 ₽	Купить
Триема Россия	SN74LVTH16373DGGR Texas Instruments	258 ₽	Купить
МосЧип Россия	SN74LVTH16373ZRDR Texas Instruments	по запросу	Купить
Океан Электроники Россия	SN74LVTH16373GRDR Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	CLVTH16373IDGGREP	CLVTH16373IDLREP	CLVTH16373MGQLREP	V62/04712-01XE	V62/04712-01YE	V62/04712-02ZA
3-State Output	Yes	Yes	Yes	Yes	Yes	Yes
Bits	16	16	16	16	16	16
F @ Nom Voltage(Max), Mhz	160	160	160	160	160	160
ICC @ Nom Voltage(Max), мА	5	5	5	5	5	5
Тип входа	TTL	TTL	TTL	TTL	TTL	TTL
Рабочий диапазон температур, C	от -40 до 85,-55 до 125	от -40 до 85,-55 до 125	от -40 до 85,-55 до 125	от -40 до 85,-55 до 125	от -40 до 85,-55 до 125	от -40 до 85,-55 до 125
Output Drive (IOL/IOH)(Max), мА	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32
Тип выхода	TTL	TTL	TTL	TTL	TTL	TTL
Package Group	TSSOP	SSOP	BGA MICROSTAR JUNIOR	TSSOP	SSOP	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)	48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
Rating	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product	HiRel Enhanced Product
Technology Family	LVT	LVT	LVT	LVT	LVT	LVT
VCC(Max), В	3.6	3.6	3.6	3.6	3.6	3.6
VCC(Min), В	2.7	2.7	2.7	2.7	2.7	2.7
tpd @ Nom Voltage(Max), нс	3.8	3.8	3.8	3.8	3.8	3.8

Экологический статус

Application Notes

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  LVT Family Characteristics (Rev. A)
  PDF, 98 Кб, Версия: A, Файл опубликован: 1 мар 1998
  To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
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  LVT-to-LVTH Conversion
  PDF, 84 Кб, Файл опубликован: 8 дек 1998
  Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
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  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Кб, Файл опубликован: 1 май 1996
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  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Кб, Файл опубликован: 10 май 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
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  Power-Up Behavior of Clocked Devices (Rev. A)
  PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015

Модельный ряд

Классификация производителя

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers