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Datasheet Texas Instruments SN74LVTH32373-EP — Даташит

ПроизводительTexas Instruments
СерияSN74LVTH32373-EP

Усовершенствованный продукт, 3,3 В, 32-разрядная прозрачная защелка типа D с выходами с 3 состояниями

Datasheets

SN74LVTH32373-EP
PDF, 218 Кб, Файл опубликован: 10 дек 2003

Цены

21 предложений от 18 поставщиков
Микросхема Логический замок, 3.3V ABT 32Bit Transparent D-Type Latch With 3-State Outputs 96-LFBGA -40℃ to 85℃
Lixinc Electronics
Весь мир
SN74LVTH32373ZKER
Texas Instruments
от 100 ₽
T-electron
Россия и страны СНГ
SN74LVTH32373ZKER
Texas Instruments
129 ₽
ЭИК
Россия
SN74LVTH32373GKER
Texas Instruments
542 ₽
727GS
Весь мир
SN74LVTH32373GKER
Texas Instruments
43 004 ₽

Статус

CLVTH32373IGKEREPV62/04721-01XA
Статус продуктаВ производствеВ производстве
Доступность образцов у производителяНетНет

Корпус / Упаковка / Маркировка

CLVTH32373IGKEREPV62/04721-01XA
N12
Pin9696
Package TypeGKEGKE
Industry STD TermBGA MICROSTARBGA MICROSTAR
JEDEC CodeR-PBGA-NR-PBGA-N
Package QTY10001000
CarrierLARGE T&RLARGE T&R
МаркировкаL373EPL373EP
Width (мм)5.55.5
Length (мм)13.513.5
Thickness (мм).9.9
Pitch (мм).8.8
Max Height (мм)1.41.4
Mechanical DataСкачатьСкачать

Параметры

Parameters / ModelsCLVTH32373IGKEREPV62/04721-01XA
3-State OutputYesYes
Bits(#)3232
F @ Nom Voltage(Max)(Mhz)160160
ICC @ Nom Voltage(Max)(mA)1010
Тип входаTTLTTL
LogicTrueTrue
Operating Temperature Range(C)-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max)(mA)64/-3264/-32
Тип выходаTTLTTL
Package GroupLFBGALFBGA
Package Size: mm2:W x L (PKG)96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA)96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA)
RatingHiRel Enhanced ProductHiRel Enhanced Product
Technology FamilyLVTLVT
VCC(Max)(V)3.63.6
VCC(Min)(V)2.72.7
tpd @ Nom Voltage(Max)(ns)3.83.8

Экологический статус

CLVTH32373IGKEREPV62/04721-01XA
RoHSTBDTBD
Бессвинцовая технология (Pb Free)НетНет

Application Notes

  • LVT Family Characteristics (Rev. A)
    PDF, 98 Кб, Версия: A, Файл опубликован: 1 мар 1998
    To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
  • LVT-to-LVTH Conversion
    PDF, 84 Кб, Файл опубликован: 8 дек 1998
    Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Кб, Версия: B, Файл опубликован: 22 май 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Кб, Версия: A, Файл опубликован: 1 авг 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Кб, Файл опубликован: 1 май 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Кб, Файл опубликован: 10 май 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Кб, Версия: A, Файл опубликован: 6 фев 2015

Модельный ряд

Серия: SN74LVTH32373-EP (2)

Классификация производителя

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers

На английском языке: Datasheet Texas Instruments SN74LVTH32373-EP

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