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Datasheet Texas Instruments CSSTV32852GKFREP — Даташит

ПроизводительTexas Instruments
СерияSN74SSTV32852-EP
МодельCSSTV32852GKFREP
Datasheet Texas Instruments CSSTV32852GKFREP

Усовершенствованный продукт Регистровый буфер от 24 до 48 бит с входами и выходами Sstl_2 114-BGA MICROSTAR от -40 до 85

Datasheets

24 Bit To 48 Bit Registered Buffer With SSTL_2 Inputs And Outputs datasheet
PDF, 368 Кб, Файл опубликован: 16 авг 2007
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Цены

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Микросхема Логический чип, Enhanced Product 24Bit To 48Bit Registered Buffer With Sstl_2 Inputs And Outputs 114-BGA MICROSTAR -40℃ to 85℃
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Статус

Статус продуктаВ производстве (Рекомендуется для новых разработок)
Доступность образцов у производителяНет

Корпус / Упаковка / Маркировка

Pin114
Package TypeGKF
Industry STD TermBGA MICROSTAR
JEDEC CodeR-PBGA-N
Package QTY1000
CarrierLARGE T&R
МаркировкаSV852IEP
Width (мм)5.5
Length (мм)16
Thickness (мм).9
Pitch (мм).8
Max Height (мм)1.4
Mechanical DataСкачать

Параметры

Количество выходов48
Рабочий диапазон температурот -40 до 85 C
Output Drive20 мА
Package GroupBGA MICROSTAR
Package Size: mm2:W x L114BGA MICROSTAR: 88 mm2: 5.5 x 16(BGA MICROSTAR) PKG
RatingHiRel Enhanced Product
VCC2.5 В

Экологический статус

RoHSSee ti.com

Application Notes

  • 56-Pin Quad Flatpack No-Lead Logic Package
    PDF, 275 Кб, Файл опубликован: 7 фев 2003
    Texas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages over traditional SOIC, TQFP, TSSOP, and TVSOP packaging. This package, designated RGQ by TI, physically is smaller than traditional leaded solutions, has a smaller routing area, improved thermal performance, and improved electric
  • Application of the SN74SSTV32852 in Stacked, Low-Profile (1U) PC-1600/2100 DIMMs
    PDF, 445 Кб, Файл опубликован: 7 ноя 2001
    Many memory-module manufacturers are turning to low-profile (1U) DIMM designs that significantly increase memory density in computer workstations and servers. The reduction in DIMM height consequently affects the design and layout of the boards. The stacked 1U DIMMs present a unique and challenging problem due partly to the reduction in area for mounting components and also due to the load. The TI
  • Application of the SN74SSTVF16857 in Planar PC2700 (DDR-333) RDIMMs
    PDF, 359 Кб, Файл опубликован: 10 янв 2003
    The high-capacity memory modules used in servers and workstations present a complex load to the memory controller used in these high-reliability, high-performance systems. To meet the demands of stable functionality over a broad spectrum of operating environments and system timing needs, and to support data integrity, these dual in-line memory modules (DIMMs) require the use of registers in the ad
  • Low-Power Support Using Texas Instruments SN74SSTV16857 and SN74SSTV16859
    PDF, 138 Кб, Файл опубликован: 9 фев 2001
    The Texas Instruments SN74SSTV16857 and SN74SSTV16859 registers support the low-power mode of the DDR-DIMM. This application report explains the low-power mode and the features of the registers that support the low-power mode. Also, the considerations that the system designer must be aware of when implementing the low-power state of a registered memory module are explained. The sequence that must

Модельный ряд

Серия: SN74SSTV32852-EP (2)

Классификация производителя

  • Semiconductors > Space & High Reliability > Clock & Timing Products > Memory Interface Clock and Register

На английском языке: Datasheet Texas Instruments CSSTV32852GKFREP

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