Datasheet Texas Instruments TMS320C6652 — Даташит
| Производитель | Texas Instruments |
| Серия | TMS320C6652 |
Fixed and Floating Point Digital Signal Processor
Datasheets
TMS320C6652 and TMS320C6654 Fixed and Floating-Point Digital Signal Processor datasheet
PDF, 1.7 Мб, Версия: D, Файл опубликован: 22 июн 2016
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Цены
 Купить TMS320C6652 на РадиоЛоцман.Цены — от 3 079 до 9 039 ₽15 предложений от 9 поставщиков DSP Fixed-Point/Floating-Point 16Bit 600MHz 27200MIPS 625Pin FCBGA | |||
| TMS320C6652CZH6 Texas Instruments | 3 079 ₽ | ||
| TMS320C6652CZH6 Texas Instruments | 3 147 ₽ | ||
| TMS320C6652CZHA6 Texas Instruments | 3 601 ₽ | ||
| TMS320C6652CZHA6 Texas Instruments | по запросу | ||
Статус
| TMS320C6652CZH6 | TMS320C6652CZHA6 | |
|---|---|---|
| Статус продукта | В производстве | В производстве |
| Доступность образцов у производителя | Нет | Нет |
Корпус / Упаковка / Маркировка
| TMS320C6652CZH6 | TMS320C6652CZHA6 | |
|---|---|---|
| N | 1 | 2 |
| Pin | 625 | 625 |
| Package Type | CZH | CZH |
| Package QTY | 1 | 1 |
| Carrier | NOT REQUIRED | NOT REQUIRED |
| Маркировка | TMS320C6652CZH | @2012 TI |
| Width (мм) | 21 | 21 |
| Length (мм) | 21 | 21 |
| Thickness (мм) | 2.42 | 2.42 |
| Mechanical Data | Скачать | Скачать |
Параметры
| Parameters / Models | TMS320C6652CZH6 | TMS320C6652CZHA6 |
|---|---|---|
| Applications | Machine Vision | Machine Vision |
| DRAM | DDR3 | DDR3 |
| DSP | 1 C66x | 1 C66x |
| DSP MHz, Max. | 600 | 600 |
| GFLOPS | 9.6 | 9.6 |
| On-Chip L2 Cache | 1024 KB | 1024 KB |
| Рабочий диапазон температур, C | от -40 до 100,0 до 85 | от -40 до 100,0 до 85 |
| Other On-Chip Memory | 1024 KB | 1024 KB |
| Package Size: mm2:W x L, PKG | See datasheet (FCBGA) | See datasheet (FCBGA) |
| Rating | Catalog | Catalog |
| Serial I/O | I2C,SPI,UART,UPP | I2C,SPI,UART,UPP |
| Total On-Chip Memory, KB | 1088 | 1088 |
Экологический статус
| TMS320C6652CZH6 | TMS320C6652CZHA6 | |
|---|---|---|
| RoHS | Совместим | Совместим |
Application Notes
- Hardware Design Guide for KeyStone Devices (Rev. C)PDF, 1.7 Мб, Версия: C, Файл опубликован: 15 сен 2013
- TMS320C66x DSP Generation of Devices (Rev. A)PDF, 245 Кб, Версия: A, Файл опубликован: 25 апр 2011
- KeyStone I DDR3 Initialization (Rev. E)PDF, 114 Кб, Версия: E, Файл опубликован: 28 окт 2016
The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - Clocking Design Guide for KeyStone DevicesPDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - Optimizing Loops on the C66x DSPPDF, 585 Кб, Файл опубликован: 9 ноя 2010
- DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
- TI DSP BenchmarkingPDF, 62 Кб, Файл опубликован: 13 янв 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015
Модельный ряд
Серия: TMS320C6652 (2)
Классификация производителя
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP
