Datasheet Texas Instruments TMS320C6655 — Даташит

Производитель	Texas Instruments
Серия	TMS320C6655

Datasheets

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Кремний Россия и страны СНГ	TMS320C6655SCZH Texas Instruments	по запросу	Купить

Статус

Корпус / Упаковка / Маркировка

Параметры

Parameters / Models	TMS320C6655CZH	TMS320C6655CZH25	TMS320C6655CZHA	TMS320C6655CZHA25	TMS320C6655GZHA	TMS320C6655SCZH
Applications	Avionics & Defense,Machine Vision	Avionics & Defense,Machine Vision	Avionics & Defense,Machine Vision	Avionics & Defense,Machine Vision	Avionics & Defense,Machine Vision	Avionics & Defense,Machine Vision
DRAM	DDR3	DDR3	DDR3	DDR3	DDR3	DDR3
DSP	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x
DSP MHz, Max.	1000,1250	1000,1250	1000,1250	1000,1250	1000,1250	1000,1250
EMAC	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000	10/100/1000
GFLOPS	16,20	16,20	16,20	16,20	16,20	16,20
Hardware Accelerators	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d	VCP2,TCP3d
On-Chip L2 Cache	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB
Рабочий диапазон температур, C	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85	от -40 до 100,0 до 85
Other On-Chip Memory	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB	1024 KB
PCI/PCIe	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2	2 PCIe Gen2
Package Size: mm2:W x L, PKG	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)	See datasheet (FCBGA)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Serial I/O	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART	Hyperlink,I2C,RapidIO,SPI,TSIP,UART
Serial RapidIO	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)	1 (four lanes)
Total On-Chip Memory, KB	2278	2278	2278	2278	2278	2278

Экологический статус

Application Notes

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  TI Keystone DSP Hyperlink SerDes IBIS-AMI Models
  PDF, 3.2 Мб, Файл опубликован: 9 окт 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP Hyperlink interface.
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  TI Keystone DSP PCIe SerDes IBIS-AMI Models
  PDF, 4.8 Мб, Файл опубликован: 9 окт 2014
  This document describes the organization, structure, and proper usage of the TI serializer and deserializer (SerDes) IBIS-AMI models for Keystone DSP PCIe interface.
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  SerDes Implementation Guidelines for KeyStone I Devices
  PDF, 590 Кб, Файл опубликован: 31 окт 2012
  The goal of KeyStone I SerDes collateral material is to make system implementation easier for the customer by providing the system solution. For these SerDes-based interfaces, it is not assumed that the system designer is familiar with the industry specifications, SerDes technology, or RF/microwave PCB design. However, it is still expected that the PCB design work will be supervised by a knowledge
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  KeyStone I DDR3 Initialization (Rev. E)
  PDF, 114 Кб, Версия: E, Файл опубликован: 28 окт 2016
  The initialization of the DDR3 DRAM controller on KeyStone I DSPs is straightforward as long as the proper steps are followed. However, if some steps are omitted or if some sequence-sensitive steps are implemented in the wrong order, DDR3 operation will be unpredictable.All DDR3 initialization routines must contain the basic register writes to configure the memory controller within the DSP
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  TMS320C66x DSP Generation of Devices (Rev. A)
  PDF, 245 Кб, Версия: A, Файл опубликован: 25 апр 2011
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  Hardware Design Guide for KeyStone Devices (Rev. C)
  PDF, 1.7 Мб, Версия: C, Файл опубликован: 15 сен 2013
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  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Мб, Версия: A, Файл опубликован: 1 май 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
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  SERDES Link Commissioning on KeyStone I and II Devices
  PDF, 138 Кб, Файл опубликован: 13 апр 2016
  The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
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  PCIe Use Cases for KeyStone Devices
  PDF, 320 Кб, Файл опубликован: 13 дек 2011
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  The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
  PDF, 20 Кб, Версия: A, Файл опубликован: 10 ноя 2010
  The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
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  Optimizing Loops on the C66x DSP
  PDF, 585 Кб, Файл опубликован: 9 ноя 2010
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  Clocking Design Guide for KeyStone Devices
  PDF, 1.5 Мб, Файл опубликован: 9 ноя 2010
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  DDR3 Design Requirements for KeyStone Devices (Rev. B)
  PDF, 582 Кб, Версия: B, Файл опубликован: 5 июн 2014
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  Multicore Programming Guide (Rev. B)
  PDF, 1.8 Мб, Версия: B, Файл опубликован: 29 авг 2012
  As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
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  TI DSP Benchmarking
  PDF, 62 Кб, Файл опубликован: 13 янв 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
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  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Кб, Версия: A, Файл опубликован: 17 авг 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Мб, Версия: B, Файл опубликован: 13 авг 2015

Модельный ряд

Классификация производителя

• Semiconductors> Processors> Digital Signal Processors> C6000 DSP> C66x DSP