Datasheet Intersil HI5860IB — Даташит

DATASHEET
HI5860 FN4654
Rev 7.00
February 6, 2008 12-Bit, 130MSPS, High Speed D/A Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture. Features This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices. Single Power Supply from +5V to +3V Throughput Rate 130MSPS Low Power . 175mW at 5V, 32mW at 3V (At 100MSPS) Integral Linearity Error (Typ) . В±0.5 LSB Adjustable Full Scale Output Current . 2mA to 20mA Internal 1.2V Bandgap Voltage Reference Power-Down Mode CMOS Compatible Inputs Pinout Excellent Spurious Free Dynamic Range
(76dBc, f S = 50MSPS, fOUT = 2.51MHz) HI5860
(28 LD SOIC, TSSOP)
TOP VIEW
(MSB) D11 1 Excellent Multitone Intermodulation Distortion
28 CLK Pb-Free Available (RoHS Compliant) D10 2 27 DVDD D9 3 26 DCOM D8 4 25 ACOM D7 5 24 AVDD D6 6 23 COMP2 Medical/Test Instrumentation D5 7 22 IOUTA Wireless Communications Systems D4 8 21 IOUTB D3 9 20 ACOM D2 10 19 COMP1 Signal Reconstruction D1 11 18 FSADJ High Resolution Imaging Systems (LSB) D0 12 17 REFIO Applications Basestations (Cellular, WLL) Direct Digital Frequency Synthesis NC 13 16 REFLO NC 14 15 SLEEP Arbitrary Waveform Generators Ordering Information
PART
NUMBER PART MARKING TEMP. RANGE (В°C) PACKAGE PKG. DWG. # CLOCK SPEED HI5860IA* HI5860 IA -40 to +85 28 Ld TSSOP M28.173 130MHz HI5860IB HI5860IB -40 to +85 28 Ld SOIC M28.3 130MHz HI5860IBZ*
(Note) HI5860IBZ -40 to +85 28 Ld SOIC (Pb-free) M28.3 130MHz HI5860SOICEVAL1 +25 Evaluation Platform 130MHz *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% …