Datasheet Microchip MCP87090T-U/MF — Даташит

MCP87090
High-Speed N-Channel Power MOSFET
Features: Description: Low Drain-to-Source On Resistance (RDS(ON) Low Total Gate Charge (QG) and Gate-to-Drain
Charge (QGD) Low Series Gate Resistance (RG) Capable of Short Dead-Time Operation RoHS Compliant The MCP87090 is an N-Channel power MOSFET in a
popular PDFN 5 mm x 6 mm package, as well as a
PDFN
3.3 mm x 3.3 mm
package.
Advanced
packaging and silicon processing technologies allow
the MCP87090 to achieve a low QG for a given RDS(ON)
value, resulting in a low Figure of Merit (FOM).
Combined with low RG, the low FOM of the MCP87090
device allows high efficiency power conversion with
reduced switching and conduction losses. Applications: Point-of-Load DC-DC Converters High Efficiency Power Management in Servers,
Networking, and Automotive Applications Package Type
PDFN 5 x 6 PDFN 3.3 x 3.3 S 1 8 D S 2 7 D S 3 6 D G 4 5 D Product Summary Table: Unless otherwise indicated, TA = +25ЛљC
Parameters Sym. Min. Typ. Max. Units Conditions Drain-to-Source Breakdown Voltage BVDSS 25 — — V VGS = 0V, ID = 250 µA Gate-to-Source Threshold Voltage VGS(TH) 1.1 1.35 1.7 V VDS = VGS, ID = 250 µA Drain-to-Source On Resistance RDS(ON) — 10 12 mΩ Operating Characteristics VGS = 4.5V, ID = 17A — 8.5 10.5 mΩ VGS = 10V, ID = 17A Total Gate Charge QG — 7.5 10 nC VDS = 12.5V, ID = 17A, VGS = 4.5V Gate-to-Drain Charge QGD — 2.8 — nC VDS = 12.5V, ID = 17A RG — 1.8 — Ω Series Gate Resistance
Thermal Characteristics
Thermal Resistance Junction-to-X, 8L 3.3x3.3-PDFN RθJX — — 70 °C/W Note 1 Thermal Resistance Junction-to-Case, 8L 3.3x3.3-PDFN RθJC — — 3.3 °C/W Note 2 Thermal Resistance Junction-to-X, 8L 5x6-PDFN RθJX — — 55 °C/W Note 1 Thermal Resistance Junction-to-Case, 8L 5x6-PDFN RθJC — — 3.2 °C/W Note 2 Note 1:
2: RθJX is determined with the device surface mounted on a 4-Layer FR4 PCB, with a 1” x 1” mounting pad of 2 oz. copper.
This characteristic is dependent on user’s board design.
RОёJC is determined using JEDEC 51-14 Method. This characteristic is determined by design. пѓЈ 2013 Microchip Technology Inc. DS20002332B-page 1 MCP87090 …