Корпус Intersil V172.8x8 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
V172.8x8
172 THIN, FINE PITCH BALL GRID ARRAY PACKAGE
Rev 0, 12/12
COMMON DIMENSIONS
SYMBOL
PIN A1 CORNER MIN NOM Package TFBGA Body Size X E 8.000 Y D 8.000 e 0.500 Ball Pitch
Total Thickness A Mold Thickness M 0.530 Ref. 1.200 Substrate Thickness S 0.260 Ref. Ball Diameter TOP VIEW MAX 0.300 Stand Off A1 0.160 -0.500 Ball Width b 0.270 -0.600 Package Edge Tolerance aaa 0.100 Mold Parallelism bbb 0.100 Coplanarity ddd 0.080 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count n 172 Edge Ball Center to Center X E1 6.500 Y D1 6.500 NOTES:
1. Dimensions are in millimeters.
3 4 5 6 7 8 9 10 11 D1 D 12 13 14 2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994.
3. “N” is the total number of balls.
P
N
M
L
K
J
H
G
F
E
D
C …