Plastic Packages for Integrated Circuits
Plastic Ball Grid Array Packages (BGA)
o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES A1 CORNER I.D. E B
TOP VIEW
0.15
M C A B
0.006
0.08
M C
0.003
b A1
CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S A S
A A1
CORNER I.D. MIN MAX MIN MAX NOTES A -0.059 -1.50 -A1 0.012 0.016 0.31 0.41 -A2 0.037 0.044 0.93 1.11 -b 0.016 0.020 0.41 0.51 7 D/E 0.468 0.476 11.90 12.10 -D1/E1 0.405 0.413 10.30 10.50 -N 196 196 -e 0.032 BSC 0.80 BSC -MD/ME 14 x 14 14 x 14 3 bbb 0.004 0.10 -aaa 0.005 0.12 Rev. 2 12/00 NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact. e 7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spherical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body …
