Корпус Intersil L10.3x3 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L10.3x3
10 LEAD DUAL FLAT PACKAGE (DFN)
Rev 11, 3/15
3.00 5
PIN #1 INDEX AREA A
B
1 5
PIN 1
INDEX AREA (4X) 3.00 2.00
8x 0.50 2 10 x 0.23 0.10
1.60 TOP VIEW 10x 0.35 BOTTOM VIEW
(4X) 0.10 M C A B 0.415
0.200 0.23 0.35 (10 x 0.55) SEE DETAIL "X" (10x 0.23)
1.00
MAX 0.10 C 0.20 2.00
(8x 0.50) BASE PLANE C SEATING PLANE
0.08 C
SIDE VIEW 0.415
C 1.60 0.20 REF 4 0.05
2.85 TYP DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be …