Корпус Intersil V256.17x17B — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
V256.17x17B
256 LOW PROFILE PLASTIC BALL GRID ARRAY PACKAGE (LBGA)
Rev 0, 1/12
Г?0.50(3X). REF COMMON
SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package LBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 В±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter CA(4X) 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area X M 15.000 Y N 15.000 Chamfer CA 1.200 Ref. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.200 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M Г?eee M C A B
Г?b(n X)
16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A
B
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D
E
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J
K
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M
N
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