Корпус Intersil L10.3x3B — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L10.3x3B
10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD
Rev 4, 4/15
3.00 5
PIN #1 INDEX AREA A
B
1
2
0.50 3.00 2.38 +0.1/ -0.15 10
5
PIN 1
INDEX AREA 0.25 +0.05/ -0.07 6
(4X) 0.15
1.64 +0.1/ -0.15 TOP VIEW BOTTOM VIEW 10x 0.40 +/-0.1 SEE DETAIL "X" (10x0.60)
(10X0.25)
0.75 0.10 C SEATING PLANE
0.08 C 2.38 0.05 C SIDE VIEW (8x 0.50) 1.64
2.80 TYP
TYPICAL RECOMMENDED LAND PATTERN C 0.20 REF 4 0.05
DETAIL "X" NOTES: 1 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be …