Корпус Intersil L12.4x3A — Даташит

Plastic Packages for Integrated Circuits
Thin Dual Flat No-Lead Plastic Package (TDFN)
L12.4x3A
12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C) 2X
0.15 C A
A D MILLIMETERS 2X
0.15 C B SYMBOL MIN A 0.70 A1 -A3 E b 6
INDEX
AREA D2 0.18 E2 3.15 0.10 A 0.08 C
C -0.05 -0.23 0.30 5,8 3.30 3.40 7,8 3.00 BSC
1.55 e // NOTES 0.80 4.00 BSC E TOP VIEW MAX 0.75
0.20 REF D
B NOMINAL 1.70 1.80 7,8 0.50 BSC -k 0.20 -L 0.30 0.40 0.50 8 N 12 2 Nd 6 3
Rev. 1 10/15 C NOTES: A3 SEATING
PLANE 1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals. SIDE VIEW 3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
D2
(DATUM B)
6
INDEX
AREA 7 5. Dimension b applies to the metallized terminal and is measured …