Корпус Intersil L18.5x3 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L18.5x3
18 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 2, 4/15 3.00 6
PIN #1 INDEX AREA A B 6
PIN 1
INDEX AREA 18 1 4 . 40 В± 0 . 15 5.00 16X 0.50 9 0.10 M C A B
(4X) 0.15 b 4 0.25 В± 0.05 18X 0 . 4 В± 0 . 1
1.50 В± 0 . 15 TOP VIEW BOTTOM VIEW PACKAGE OUTLINE
SEE DETAIL "X"
0.10 C 0 . 75 В± 0 . 05 C BASE PLANE
SEATING PLANE
0.08 C SIDE VIEW
0.50
( 4 . 40 TYP ) 0.25 C 0 . 15 REF 5 0 . 00 MIN.
0 . 05 MAX. DETAIL "X" 0.6
( 1.50 TYP ) TYPICAL RECOMMENDED LAND PATTERN 1 NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature. …