Корпус Intersil L6.1.6x1.6B — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L6.1.6x1.6B
6 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 2, 05/15 1.60 0.60 R 0.20 A
B 6
PIN 1
INDEX AREA 0.50BSC 1.00 1.60
(4X) 6
PIN #1 INDEX AREA 0.15 1.00 6X 0.25
0.10 M C A B 6X 0.24
1.12 TOP VIEW
BOTTOM VIEW SEE DETAIL "X"
0.75
0.10 C C BASE PLANE (6X 0.6) SEATING PLANE
0.08 C 0.000-0.50 SIDE VIEW 0.50 1.00 C 0.60 5 0 . 00 MIN.
0 . 05 MAX. ( 6 X 0 . 25 ) DETAIL "X" 1.12 TYPICAL RECOMMENDED LAND PATTERN 0 . 2 REF NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal В± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and may …