Корпус Intersil L8.2x2C — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2x2C
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) WITH E-PAD
Rev 1, 5/15
2.00 6
PIN #1 INDEX AREA A
B 6
PIN 1
INDEX AREA 8 1 0.50
2.00 1.45В±0.050
Exp.DAP (4X) 0.15 0.25 0.10 M C A B ( 8x0.30 ) TOP VIEW 0.80В±0.050
Exp.DAP BOTTOM VIEW ( 8x0.20 ) Package Outline ( 8x0.30 ) SEE DETAIL "X"
( 6x0.50 ) 1.45 2.00 0.10 C 0 . 75 ( 0 . 80 max) C BASE PLANE
SEATING PLANE
0.08 C SIDE VIEW ( 8x0.25 )
0.80
2.00 TYPICAL RECOMMENDED LAND PATTERN C 0 . 2 REF 0 . 00 MIN.
0 . 05 MAX.
DETAIL "X" NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal В± 0.05 …