Корпус Intersil L8.2x2E — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2x2E
8 Lead Dual Flat No-lead Plastic Package (DFN) WITH E-PAD
Rev 0, 5/15
PIN# 1
6 INDEX AREA 6 2.00 PIN# 1
INDEX AREA A
B
8 1 0.50 1.45 В±0.050
Exp. DAP 2.00 4X 0.15 0.10 M C A B 0.25 (8x0.30) TOP VIEW
0.80 В±0.050
Exp. DAP
BOTTOM VIEW PACKAGE OUTLINE (8x0.20)
(8x0.30) SEE DETAIL "X"
0.10 C (6x0.50) 0.90 В±0.10
1.45 C BASE PLANE 2.00 SEATING PLANE
0.08 C
SIDE VIEW
(8x0.25) 0.80
2.00
C TYPICAL RECOMMENDED LAND PATTERN 0.2 REF 0. 00 MIN.
0. 05 MAX.
DETAIL "X" NOTES: …