Корпус Intersil Q100.12x12 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
Q100.12X12
100 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE (LQFP)
Rev 1, 6/11
14.00
12.00
D A 3 4 14.00
12.00 3 4 B 4X 0.20 C A-B D 4X 0.20 H A-B D BOTTOM VIEW 0.40
TOP VIEW 1.60 MAX 11/13В° 0В° MIN.
0.05
H 11/13В° C 0.08 C R. MIN. 2 R 0.08
0.20 1.60 MAX 1.35 MAX 0.16 -0.03/+0.07 0.09-0.20 SEE DETAIL "A"
0.08 M C A-B D 0.05/0.15 6 0.08
R. MIN.
0.20 MIN. SIDE VIEW 0.25
0-7В° GAUGE
PLANE
0.60 В±0.15 (1.00)
DETAIL "A"
SCALE: NONE (14.60) (0.23) TYP NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line. …