Корпус Intersil L10.3x2.6 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L10.3x2.6
10 LEAD OPTICAL DUAL FLAT NO-LEAD PACKAGE (ODFN)
Rev 1, 4/15
6
PIN 1
INDEX AREA A 3.00 0.70 3.00 B 0.50 0.30
2.25 2.60 2.60
b 4 (4X) 0.25 0.10
0.10 TOP VIEW 0.10 M C A B 0.10 0.85
BOTTOM VIEW 1.15
PACKAGE
OUTLINE 1.20 SEE DETAIL "X"
0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C 0.30 SIDE VIEW 0.25 (10X)
0.50 (6X)
1.05
1.30 C 3.40 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES:
1. Dimensions are in millimeters. …