Корпус Intersil L6.1.5x1.6 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L6.1.5x1.6
6 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)
Rev 1, 4/15 1.50
0.55
PIN #1 INDEX AREA 6
PIN 1
0.50
1.60 (2X) 0.10
0.10 M C A B 4 0.25
TOP VIEW 0.40 0.70
BOTTOM VIEW 2.00 0.18 SEE DETAIL "X" 0.80 0.10 C 0.70 В± 0.05 C
BASE PLANE
SEATING PLANE
0.08 C 0.50
SIDE VIEW
0.25
PACKAGE
OUTLINE
0.25 C
0.70 0.65 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL “X” NOTES: 1 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension applies to the metallized terminal and is measured …