Корпус Intersil L8.2.1x2.0 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2.1x2.0
8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN)
Rev 4, 5/15
2.10 A
6
PIN 1
INDEX AREA 0.15
B
0.25
6
PIN 1
INDEX AREA 0.50 1.50 2.00 1.50
0.20В±0.05 4 (2X) 0.10 M C A B 0.10
8X 0 . 35 В± 0 . 05 TOP VIEW 0.75
BOTTOM VIEW SEE DETAIL "X" 2.50 0.10 C
2.10 0.70В±0.05 C
BASE PLANE
SEATING PLANE
0.08 C SIDE VIEW
(6x0.50) (1.50) (8x0.20) C
(8x0.20) 5 0 . 00 MIN.
0 . 05 MAX. (8x0.55) DETAIL "X" (0.75) …