Plastic Packages for Integrated Circuits Package Outline Drawing
Q128.14x20H
128 LEAD PLASTIC QUAD FLATPACK PACKAGE EXPOSED PAD (PQFP)
Rev 0, 10/13
MILLIMETER D
D1
D2 SYMBOL MIN NOM MAX MIN NOM MAX A2 A -3.40 -0.134 A1 0.25 -0.010 -A2 2.50 2.72 -0.10 S A1 -A-B-4X
e
b aaa C A-B D bbb C A-B D
4X
ccc M C A-B s D s c D 23.20 BSC 0.913 BSC 20.00 BSC 0.787 BSC E 17.20 BSC 0.677 BSC E1 14.00 BSC SEE DETAIL X'' Оё Оё1 0.13 -R1 0.13 -0.005 -Оё 0В° -7В° 0В° -7В° Оё1 0В° -0В° -ddd C Оё
R 0.11 L 0.73 R2 GAGE PLANE Оё 15В° REF 0.15 0.23 0.004 0.006 0.009 0.88 1.03 0.029 0.035 0.041 1.60 REF
-0.063 REF S 0.20 -0.008 b 0.170 0.200 0.270 0.007 0.008 0.011 DETAIL X e 0.50 BSC 0.020 BSC D2 18.50 0.728 E2 12.50 0.492 12.50 2X-R2.75 BOTTOM VIEW 1 -TOLERANCES OF FORM AND POSITION
aaa 0.20 0.008 bbb 0.20 0.008 ccc 0.08 0.003 ddd 0.08 0.003 1. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm per side. Dimensions
D1 and E1 do include mold mismatch and are
determined at datum plane -H-. 3. Control dimensions are in millimeters. 11.71 -2. Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08mm total in
excess of the b dimension at maximum material
condition. Dambar cannot be located on the lower
radius or the lead foot. 13.50 DROP IN EXPOSED HEAT SLUG 0.012 15В° REF 15В° REF c -NOTES: 0.25 mm -H-0.30 0.005 15В° REF Оё3 -C-SEATING PLANE
SIDE VIEW 0.551 BSC R2 L1 TOP VIEW 2.90 0.098 0.107 0.114 D1 Оё2 L1 E
E1 …
