Корпус Intersil M20.3 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11 20
INDEX
AREA
7.60
7.40 1 2 10.65
10.00 0.25 (0.10) M B M 3 3
TOP VIEW 13.00
12.60 SEATING PLANE 2
2.65
2.35 5 0.75
1.27
BSC 0.49
0.35 7
0.25 (0.10) M 0.25 0.30
MAX C A M B S 1.27
0.40 x 45В° 8В°
MAX 0.10 (0.004) SIDE VIEW DETAIL "X" 0.32
0.23 NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
(0.60) 1.27 BSC 2. Dimension does not include mold flash, protrusions or gate …