Корпус Intersil L32.4x5A — Даташит

Plastic Packages for Integrated Circuits
Thin Quad Flat No-Lead Plastic Package (TQFN)
Micro Lead Frame Plastic Package (MLFP)
L32.4x5A A 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220) D
N
(N-1)
(N-2) B MILLIMETERS
SYMBOL 1
2
3 PIN #1
I.D. MARK
E (N/2) 2X
0.075 C 2X
0.075 C 0.10 M C A B
b (N-2)
(N-1)
N N LEADS TOP VIEW L MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 -A1 0.00 0.02 0.05 -D 4.00 BSC -D2 2.50 REF -E 5.00 BSC -E2 3.50 REF -L 0.35 0.40 0.45 -b 0.15 0.20 0.25 -c 0.20 REF -e 0.40 BSC -N 32 REF 4 ND 7 REF 6 NE 9 REF PIN #1 I.D. 5
Rev 2 8/06 3 NOTES: 1
2
3 1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. (E2) 4. N is the total number of terminals on the device. …