Корпус Intersil Q100.12x12A — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
Q100.12x12A
100 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP)
Rev 0, 2/11
14.00
12.00
D A 3 4 14.00
12.00 3 4 B 4X 0.20 C A-B D 4X 0.20 H A-B D BOTTOM VIEW 0.40 TOP VIEW 0В° MIN. H 1.20 MAX 11/13В° 2 1.00 В±0.05
0.05 C
0.09-0.20 0.16 -0.03/+0.07
0.08 M C A-B D 0.05/0.15 0.08 C 0.08
R. MIN.
0.20 MIN. SEE DETAIL "A" 0.25
0-7В°
GAUGE PLANE
0.60 В±0.15 (1.00) 6 DETAIL "A"
SCALE: NONE SIDE VIEW (14.60) (0.23) TYP NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.25mm per side.
4. These dimensions to be determined at datum plane H. (14.60) 5. Package top dimensions are smaller than bottom dimensions …