Корпус Intersil Q32.5x5A — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
Q32.5X5A
32 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP)
Rev 1, 10/11
D D
D1
D E E1 B A D e TOP VIEW BOTTOM VIEW 11o-13o
SEATING PLANE 0 MIN
A A2 -C-03 +0.07 BASE METAL o 0.08 0.003
0.20 WITH PLATING 0.020 MIN A A1 0.08 0.003 M C A-B S D S 0.09/0.16
0.004/0.006 0.25 11o-13o SIDE VIEW 0o-7o 0.09/0.20
0.004/0.008 b1
b DETAIL "A" SCALE NONE
SYMBOL
A
A1
A2
b
b1
D
E
D1
E1 …