Корпус Intersil Q80.12x12A — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
Q80.12x12A
80 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE (TQFP)
Rev 1, 3/11
14.00
12.00
D A 3 4 14.00
12.00 3 4 B 4X 0.20 C A-B D 4X BOTTOM VIEW 0.20 H A-B D 0.50 TOP VIEW 1.20 MAX 11/13В° 0В° MIN
0.05 2 H
1.00 В±0.05 C
0.09-0.20 0.20 -0.03/+0.07
0.08 M C A -B D 0.08 C SEE DETAIL "A" 6 0.05/0.15 0.08
R. MIN.
0.20 MIN. SIDE VIEW 0.25
0-7В° GAUGE
PLANE
0.60 В±0.15 (1.00)
DETAIL "A"
SCALE: NONE
(14.60) (0.28) TYP NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line. …