Корпус Intersil M20.173 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
A
1 3 6.50 В±0.10 6.40 PIN #1
I.D. MARK 4.40 В±0.10
2 SEE DETAIL "X" 10 20 3 0.20 C B A 1 9
B 0.65 0.09-0.20 TOP VIEW END VIEW 1.00 REF
H -0.05 C
0.90 +0.15/-0.10
1.20 MAX SEATING
PLANE GAUGE
PLANE
0.25 +0.05/-0.06 5
0.10 M C B A 0.10 C 0В°-8В° 0.05 MIN
0.15 MAX SIDE VIEW 0.25 0.60 В±0.15
DETAIL "X" (1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs. (5.65) Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H. …