Корпус Intersil M38.173 — Даташит

Plastic Packages for Integrated Circuits
Thin Shrink Small Outline Plastic Packages (TSSOP)
M38.173 N
INDEX
AREA E 0.25(0.010) M E1 2 INCHES GAUGE
PLANE -B1 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F) B M SYMBOL
A 3 A1 L
0.05(0.002)
-A-A D
-C-e О±
A2 A1 b
0.10(0.004) M 0.25
0.010 SEATING PLANE c
0.10(0.004) C A M B S MIN
0.002 1. These package dimensions are within allowable dimensions of
JEDEC MO-153-BD-1, Issue F.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side. …