Корпус Intersil M38.173C — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
M38.173C
38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP)
Rev 0, 4/10
PIN 1 ID B 4.6В±0.10
0.09-0.20 D
3 2 1 12 3 C
L 6.4 3.20В±0.10 4.4В±0.10
4 38 0.17-0.27 A 0.20 C A-B D
2X N/2 TIPS
0.08 M C A-B D 5 SEE
DETAIL "A" EXPOSED PAD VIEW END VIEW TOP VIEW
(14В°) TYP (1.00) 1.10 MAX
0.05 C 0.90В±0.05
0.25 C PARTING
LINE 0.10 C
0.50 0.05/0.15 9.70В±0.10 4 SEATING
PLANE SIDE VIEW H 3
(0-8В°) 0.6В±0.10
DETAIL "A" SCALE: 30/1
(VIEW ROTATED 90В°C.W.) (4.60) NOTES:
1. Die thickness allowable is 0.279В±0.0127 (0.0110В±0.0005 inches).
2. Dimensioning & tolerances per ASME. Y14.5m-1994. …