Корпус Intersil W3x3.9E — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x3.9E
3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE
Rev 0, 8/14 X Y 1.410 В± 0.030 0.400 C
9 x 0.265 В± 0.035 1.410 В± 0.030 B
0.305
A (4X) 0.10
1
TOP VIEW 2 3 PIN 1
(A1 CORNER) 0.305
BOTTOM VIEW Z
0.05 SEATING PLANE Z 3 PACKAGE OUTLINE 0.240 0.400 0.265 В± 0.035 0.290 RECOMMENDED LAND PATTERN 0.200 В± 0.030
0.500 В± 0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASMEY 14.5 -1994, and JESD 95-1 SPP-010.
3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451. 1 0.10 Z X Y 0.05 Z …