Корпус Intersil W4x5.20 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20 4x5 Array 20 Ball Wafer Level Chip Scale Package (WLCSP)
Rev 1 8/09
2.545 В± 0.02 X 2.00
20X 0.32 В± 0.03 Y 4
0.25
3
1.50 2.045 В± 0.02
2
1
0.50 0.10 PIN 1 (A1 CORNER) TOP VIEW E D C B A (4X)
0.50
BOTTOM VIEW PACKAGE OUTLINE 0.33 3
0.025 BSC
0.30 В± 0.015 0.23 В± 0.015 0.32 В± 0.03 SEATING PLANE 0.05 Z 0.10 M Z X Y
0.05 M Z 0.28 Z SIDE VIEW 0.50 4 NSMD TYPICAL RECOMMENDED LAND PATTERN NOTES:
1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994,
and JESD 95-1 SPP-10. 1 3. Back side coat 0.25mm thick applied to CSP package top. 4. NSMD refers to non-solder mask defined pad design per
Intersil tech brief www.intersil.com/data/tb/TB451.pdf …