Корпус Intersil W5x6.30C — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x6.30C
5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 6/14
1.600 X Y 2.330В±0.030 0.400
F
E 30x 0.265В±0.035 D
2.000 2.610В±0.030
C
B
A 0.305
(4X) 0.10 1 2 3 4 5 0.400 PIN 1 (A1 CORNER)
TOP VIEW 0.365 BOTTOM VIEW Z
0.05 Z PACKAGE OUTLINE SEATING PLANE
3 0.240 0.290 0.400 0.265В±0.035 30x
0.10 M Z X Y
0.05 M Z
0.200В±0.030
TYPICAL RECOMMENDED LAND PATTERN
0.500В±0.050 SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z. …