Корпус Intersil W5x7.35C — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x7.35C
35 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.5mm PITCH)
Rev 0, 12/16
X Y 2.551 В±0.030 0.500 35x 0.320 В±0.03 G
F
E 3.670 В±0.030 D
C
B
A (4X) 0.10 PIN 1
(A1 CORNER) 2 1 3 0.335 5 4 0.276 0.500 TOP VIEW BOTTOM VIEW Z
0.300 0.05 Z PACKAGE
OUTLINE SEATING PLANE
3 0.500 4
0.320 В±0.030
0.10 Z X Y 0.05 Z
5 0.250 0.240 В±0.030 6
RECOMMENDED LAND PATTERN 0.600 В±0.060
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASME Y14.5 -1994.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Dimension is measured at the maximum bump diameter parallel to primary datum Z . …