Корпус Intersil W6x7.42B — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W6x7.42B
42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
Rev 0, 1/17
X 0.400 2.570 В±0.030 Y G
42X 0.265 В±0.035 F
E 2.919 В±0.030 D
C
B 0.260 A
(4X) 0.10 1 2 3 4 6 5 0.200 TOP VIEW
PIN 1
(A1 CORNER) 0.285
BOTTOM VIEW 0.215 0.05 Z PACKAGE OUTLINE Z SEATING PLANE
3 0.265
4
0.265 В±0.035
0.10
0.05 0.400 5 6 NSMD 0.200 В±0.030 RECOMMENDED LAND PATTERN
0.500 В±0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASME Y14.5M-1994.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. …