Корпус Intersil W8x8.64 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W8x8.64
8x8 Array 64 Balls Wafer Level Chip Scale Package
Rev 0, 4/14
X 4.025 В± 0.030 Y 0.500
64x 0.320 В± 0.030 H
G
F 4.025 В± 0.030 E
D
C
B
0.263
A (4X) 0.10 1 2 3 4 5 6 0.250 PIN 1 (A1 CORNER) 7 8 0.263 TOP VIEW
BOTTOM VIEW PACKAGE OUTLINE 0.330 0.05 Z Z SEATING PLANE
3 0.500 0.280 0.320 В± 0.030
0.10 M Z X Y
0.05 M Z 0.240 В± 0.030
0.600 В± 0.060mm TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance conform to ASMEY14.5-1994.
3. NSMD refers to non-solder mask defined pad design per
Intersil Technical Brief http://www.intersil.com/data/tb/tb451.pdf 1 …