Корпус Intersil W8x8.64A — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W8x8.64A
8x8 Array 64 Balls Wafer Level Chip Scale Package (WLCSP) 0.5mm Pitch (BSC)
Rev 0, 7/14
X 4.025 В± 0.030 Y 0.500
64x 0.320 В± 0.030 H
G
F 4.025 В± 0.030 E
D
C
B
0.263
A (4X) 0.10 1 2 3 4 5 6 0.250 PIN 1 (A1 CORNER) 7 8 0.263 TOP VIEW
BOTTOM VIEW 0.05 Z
PACKAGE
OUTLINE 0.330 Z SEATING PLANE
3 0.040 (BSC)
(BACKSIDE COATING) 0.500 0.280 0.320 В± 0.030
0.10 M Z X Y
0.05 M Z 0.240 В± 0.030
0.640 В± 0.060 TYPICAL RECOMMENDED LAND PATTERN SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance conform to ASMEY14.5-1994. …