Корпус Intersil L6.1.2x1.0A — Даташит

Plastic Packages for Integrated Circuits
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A E L6.1.2x1.0A B 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS PIN 1
REFERENCE
2X
0.10 C
2X D 0.10 C SYMBOL MIN NOMINAL MAX NOTES A 0.45 0.50 0.55 -A1 -0.05 -0.127 REF A3 TOP VIEW -b 0.15 0.20 0.25 5 D 0.95 1.00 1.05 -E 1.15 1.20 1.25 -DETAIL A
0.10 C
A
7X 0.08 C e
A1 A3
SIDE VIEW C
SEATING
PLANE 4X
e DETAIL B
1 5X
L 3 0.40 BSC -L 0.30 0.35 0.40 -L1 0.40 0.45 0.50 -N 6 2 Ne 3 3 Оё 0 -12 4 L1 Rev. 2 8/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
6 4 BOTTOM VIEW b 6X
0.10 C A B
0.05 C NOTE 3 2. N is the number of terminals. …