Корпус Intersil L8.2x2 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.2x2
8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)
Rev 4, 05/15
2X 1.5 2.00 A 6
PIN 1
INDEX AREA PIN #1 INDEX AREA
6
B 6X 0.50
1 4
7X 0.4 В± 0.1 1X 0.5 В±0.1 2.00 (4X) 0.15
8 5 0.10 M C A B TOP VIEW 4 0.25 +0.05 / -0.07
BOTTOM VIEW ( 8X 0 . 25 )
SEE DETAIL "X"
( 1X 0 .70 )
0 . 55 MAX 0.10 C C BASE PLANE
SEATING PLANE
0.08 C (1.8 ) SIDE VIEW C ( 7X 0 . 60 ) 0 . 2 REF 5 0 . 00 MIN.
0 . 05 MAX.
( 6X 0 . 5 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES:
1. 1 Dimensions are in millimeters.
Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may …