Корпус Intersil K18.C — Даташит

Hermetic Packages for Integrated Circuits Package Outline Drawing
K18.C
18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE
Rev 1, 4/10
A
0.050 BSC (1.27 BSC) A 1
PIN NO. 1
ID AREA 0.450 (11.43)
0.430 (10.92) -A-2 -B-0.022 (0.56)
0.015 (0.38)
0.360 (9.14) MAX 0.004 M H A-B S D S 2
0.036 M 4 0.000 (0.00) MIN H A-B S D S TOP VIEW 6
0.045 (1.14)
0.026 (0.66) 0.009 (0.23)
0.004 (0.10) 0.340 (8.64)
0.320 (8.13) -D-0.320 (8.13)
0.280 (7.11) SEATING AND
BASE PLANE 0.030 (0.76) MIN -C-0.030 (0.76) MIN 0.125 (3.18)
0.095 (2.41)
0.240 (6.10)
0.220 (5.59) 5 0.320 (8.13)
0.280 (7.11) -H-5
SIDE VIEW NOTES: …