Hermetic Packages for Integrated Circuits
Ceramic Metal Seal Flatpack Packages (Flatpack)
E 1 K42.A TOP BRAZED
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A
A
D b
E1 S1 L
C
Q A
E2 c1 LEAD FINISH BASE
METAL (c) SYMBOL MILLIMETERS MIN MAX MIN MAX NOTES A -b 0.017 0.100 -2.54 -0.025 0.43 0.64 -b1
c 0.017 0.023 0.43 0.58 -0.007 0.013 0.18 0.33 -c1 0.007 0.010 0.18 0.25 -D 1.045 1.075 26.54 27.31 3 16.00 16.51 -17.27 3 E 0.630 0.650 E1 -0.680 E2 0.530 0.550 e 13.46 0.050 BSC 13.97 1.27 BSC 11 k --L 0.320 0.350 8.13 8.89 -(b) Q 0.045 0.065 1.14 1.65 8 SECTION A-A S1 0.000 -0.00 -6 M -0.0015 -b1
M M NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied. …
