Корпус Intersil R64.C — Даташит

Hermetic Packages for Integrated Circuits Package Outline Drawing
R64.C
64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH BOTTOM HEATSINK
Rev 1, 10/13
1.118 (28.40)
1.080 (27.43)
0.567 (14.40)
0.547 (13.90) 0.290 (7.37)
0.255 (6.48)
64 0.025 (0.635) BSC
1 49
PIN 1
INDEX AREA 48 0.567 (14.40)
0.547 (13.90) 1.118 (28.40)
1.080 (27.43) 0.010 (0.25)
0.006 (0.15) 33 16
17 32 SEE DETAIL "A" TOP VIEW 0.0075 (0.188)
0.005 (0.125) 0.135 (3.43)
0.111 (2.82) SIDE VIEW
HEATSINK
0.405 (10.29)
0.395 (10.03)
0.380 (9.655) …