Корпус Linear Technology 6.25x6.25x2.42 BGA-25 — Даташит

BGA Package
25-Lead (6.25mm Г— 6.25mm Г— 2.42mm)
A Z aaa Z E Y A1 X Z (Reference LTC DWG # 05-08-1502 Rev A) SEE NOTES A2 PIN 1
A PIN “A1”
CORNER b
D B
F b1 C e MOLD
CAP D
SUBSTRATE aaa Z H2
// bbb Z PACKAGE TOP VIEW E H1
5 DETAIL B 2 1 2.540 0.000 2. ALL DIMENSIONS ARE IN MILLIMETERS
1.270 0.3175 0.3175 1.270 3 NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 ddd M Z X Y
eee M Z 2.540 4 PACKAGE BOTTOM VIEW DETAIL B
PACKAGE SIDE VIEW Г?b (25 PLACES) 2.540 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE 0.630 В±0.025 DETAIL A 1.270
0.000 6 G 3 ccc Z 4 SEE NOTES DETAIL A 5. PRIMARY DATUM -Z-IS SEATING PLANE 0.3175 6 DIMENSIONS 0.3175
1.270
2.540 SUGGESTED PCB LAYOUT
TOP VIEW SYMBOL
A …